Magazine fall05 consideringoverlay by KLA Corporation

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Considering Overlay Metrology in the DFM Discussion Mike Adel, KLA-Tencor Corporation

Overlay metrology has become a cornerstone requirement which enables modern lithographic patterning. The mantra of metrology engineers in the litho cell and tool vendors alike has traditionally been TMU — Total Measurement Uncertainty — a metric which combines all sources of metrology tool-related uncertainty. Although relentless TMU reduction is essential, it is certainly not a sufﬁcient condition to meet the overlay control needs for the 32 nm node and below. Many other “on wafer” contributors must be factored into the uncertainty equation. A wider scope in the deﬁnition of the overlay metrology process is required, particularly one which views it as part of the greater IC manufacturing process. Current and emerging overlay metrology industry practices will be reviewed in light of the increasing complexity associated with the interactions between metrology tool, target design, and the sampling plan.

Introduction

where reference is made to precision with the qualiﬁcation that it includes tool-to-tool matching3. That is why the overlay metrology process should be viewed as part of the greater IC manufacturing process. This is illustrated schematically in Figure 1. In this article a deﬁnition of the meaning of Design for Manufacture (DFM) in the context of overlay metrology will be proposed. The design process will then be illustrated by two case studies which exemplify two of the steps in the process.

TMU is a statistical concoction whose deﬁnition varies markedly over the globe1-2, but is generally structured as a root sum squares of a combination of short-term precision, long-term precision, across wafer tool induced shift variation, and tool-to-tool matching. Interestingly, with respect to overlay metrology, the term TMU does not even appear in the 2004 ITRS roadmap,

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Figure 1. Schematic depiction of uncertainty contributors to overlay model residuals.

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driven by speciﬁc sample plans. This approach may seem obvious but has not necessarily been the case in the past. As will be demonstrated in the example below, signiﬁcant opportunities exist to improve the DFM process on overlay metrology.

Example 1 — Sampling and Model Optimization

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Modeling of overlay metrology data is performed routinely on data acquired on product wafers. This type of modeling serves two primary purposes, lot dispositioning and feedback of correctibles to the exposure tool.

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�� Figure 2. Schematic depiction of DFM methodology for overlay metrology, showing the three elements of sample and model, metrology target, and metrology tool. Semiconductor manufacturing processes are at the center, driving the requirements of all three elements.

Today, a frequently applied method of overlay modeling is the “double pass” method

What is DFM for overlay metrology?

DFM in overlay metrology dictates recognition of the three elements in the metrology process: sample plan/model, overlay target, and overlay tool. Figure 1 is a graphical representation of these three overlay metrology system components and the dependencies between them. A DFM approach puts the semiconductor manufacturing process at the center, driving the requirements for each of the elements. Amongst the three elements exists a clear hierarchy within the triad, deﬁning the sequence of optimization. The sample plan and the model must be a primary consideration in the overall system design, as this is driven directly by the overlay control error budget and the sources of variation characteristic of the alignment scheme in question. Next in the optimization sequence is the overlay mark design. This is impacted directly by the sample plan, e.g. target size requirements. Compatibility with the semiconductor manufacturing process, e.g. maintaining pattern density requirements for compatibility with CMP, is also a factor. The metrology tool is placed at the bottom of the hierarchy, since its design and performance parameters are derived by demanding compatibility with all of the above; for example: the ability to meet metrology uncertainty requirements on optimized metrology marks with throughput, which meets cost of ownership requirements

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Figure 3. Typical overlay metrology modeling sequence, known as the double pass method enabling both lot rework and scanner adjustment decisions.

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Example 2 — Target Optimization

Figure 4. Modiﬁed overlay metrology modeling sequence, in which the mean

Today, virtually all semiconductor manufacturers live with model residuals which are well beyond the level anticipated based on metrology tool or lithography process uncertainty contributors. Furthermore, some manufacturers are forced to add costly process steps because the metrology tool/target interaction is negatively impacted by CMP, deposition, or etch processes.

intraﬁeld model step is modiﬁed and additional weighting is enabled.

described in the flowchart, depicted in Figure 3. In this method it is assumed that the sources of overlay variation across the wafer may be divided into wafer level or “interfield” contributors and field level or “intrafield” contributors. In keeping with this assumption, under normal high-volume production circum�� stances, only two sets of correctibles, one linear �� in wafer coordinates and one linear in field coordinates, are fed back to the exposure tool’s �� wafer and reticle stages, respectively. ��

These correctibles are also used for the purpose of computing a lot dispositioning parameter such as maximum predicted overlay (MPO), the second key decision driven by overlay metrology data. This procedure is diagrammed in Figure 3. Overlay metrology data may show significant field-to-field variation in the intrafield model terms4. As a result, the model residuals— that is, the differences between the measured overlay and that computed by the model at the same point—are often strongly influenced

This is a strong indication that an opportunity exists to improve lot dispositioning and correctibles accuracy. An alternative modeling sequence to that in Figure 3 is shown in Figure 4. In this case, intrafield correctibles are computed field by field prior to calculation of MPO or any other lot dispositioning parameter. Furthermore, the intrafield correctibles sent back to the scanner can now be determined in a more sophisticated fashion, which may give weight to or even ignore certain fields based on other criteria such as overlay target asymmetry, target noise, or even alignment data from the scanner. Alternatively, if the intrafield model is allowed to vary from field to field, then the impact of this field averaging on the model residuals can be quantified. Figure 5 shows the three sigma overlay model uncertainty at the field corners due only to the field-to-field intrafield correctibles variability. This calculation has been performed on overlay data from both production environments and R&D studies.

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or even dominated by the field-to-field variation, since the standard model relies on “average” intrafield model terms.

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Figure 5. Three sigma overlay model uncertainty at the field corners due only to the field-to-field intrafield correctibles variability. Data from 130 and 90 nm processes in both production and R&D environments.

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Figure 6. Overlay metrology targets: left box-in-box targets from two different sites on the wafer; right, AIM grating targets from same sites. Box targets suffer from strongly asymmetric contrast variations compared with AIM. Courtesy of ST Microelectronics.

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Conclusions

A DFM approach to overlay metrology dictates an optimization sequence as follows: 1. Optimize model and�� sample plan for sources of variation. �� 2. Optimize target for 1 above and for semiconductor manufacturing process.

3. Optimize tool for 1 & 2. Figure 6 shows box-in-box and AIM targets from different locations on wafers from a 130 nm FEOL flash Examples of optimization from steps 1 and 2 have been �� memory process. The two examples of box targets on shown. In the first case it was shown that field-to-field the left are from two different locations on the wafer. �� intrafield variability in model terms is a significant conStrong variations in target asymmetry are observed �� tributor to model residuals. Under these circumstances, in the images. On the right of the figure, images are model and sample optimization is proposed which can �� shown of AIM targets printed adjacent to the box potentially improve lot dispositioning and correctibles �� targets on the left. Although a contrast reversal is accuracy. In the second case, target optimization for �� observed in the grating image between the two locacompatibility with the semiconductor manufacturing � tions, image asymmetry is significantly reduced to process was shown to significantly reduce overlay model � enable a major improvement in metrology robustness. residuals and improve residuals XY symmetry. In� this particular case, migration of the metrology � process from standard box targets to AIM targets In the near future, the metrology tools themselves will � resulted in a 50 percent reduction in overlay model have to be further optimized not just for reduction in �� residuals, as shown in Figure 7. A careful inspection of �� tool uncertainty as quantified in brief evaluations. The this data also reveals a reduction in the XY asymmetry optimization metric will be the enabling of a rapid inherent in the box-in-box residuals. transition to consistent peak performance on processcompatible metrology marks for new and challenging process layers in an expanding repertoire of sample plans.

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� A number of advanced IC manufacturers are overcoming these challenges by adopting new practices including � using AIM targets for improved process compatibility � and stability. The AIM target, as opposed to the box� in-box target, is comprised of a grating structure5, allowing it to meet pattern density requirements set down by other manufacturing steps such as CMP or etch. This has been characterized in a number of ways in previous publications6-7.

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Figure 7. Three sigma overlay model residuals in nm from a 130 nm ﬂash memory process, before and after transition�� from BiB to AIM based metrology. Data courtesy of STMicroelectronics - R2 Technology Center FTM - Lithography, Agrate B. Italy.

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Acknowledgments

The author would like to thank the OCSLI consortium partners for providing part of the data. Thanks also to STMicroelectronics - R2 Technology Center - FTM - Lithography, Agrate for allowing the use of the AIM residuals data. The author is indebted to the following individuals for their contributions in the preparation of this work – Pavel Izikson of KLA-Tencor Israel for his probing statistical analysis, John Robinson of KLA-Tencor, and Austin and Bernd Schulz of AMD Saxony for insightful comments and discussions. References 1. A. F. Plambeck, “Overlay metrology as it approaches the gigabit era,” Microlithography World, Winter 1996, pp. 17-22. 2. C. Gould, “Advanced Process Control: Basic Functionality Requirements for Lithography,” 2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp. 49-53. 3. International Technology Roadmap for Semiconductors (ITRS) 2004 Update, Section Metrology, p. 6, Table 117a Lithography Wafer Metrology Technology Requirements— Near-term.

4. P. Leray, I. Pollentier, E. Kassel, P. Izikson, M. Adel, B. Schulz, R. Seltmann, J. Krause “In ﬁeld overlay uncertainty contributors” in Proceedings of SPIE Vol. 5752, Metrology, Inspection, and Process Control for Microlithography XIX, D. J. Herr, Editor, (SPIE, Bellingham, WA, 2005), to be published. 5. M. Adel, M. Ghinovker, B. Golovanevsky, P. Izikson, E. Kassel, D. Yaffe, A. M. Bruckstein, R. Goldenberg, Y. Rubner, and M. Rudzsky, “Optimized Overlay Metrology Marks: Theory and Experiment” IEEE Transactions on Semiconductor Manufacturing, Vol. 17 , No.2, May 2004. 6. M. Adel, J.A. Allgair, D. C. Benoit, M. Ghinovker, E. Kassel, C. Nelson, J. C. Robinson, G. S. Seligman, “Performance Study of New Segmented Overlay Marks for Advanced Wafer Processing,” in Proceedings of SPIE vol. 5038 Metrology, Inspection, and Process Control for Microlithography XVII, D. J. Herr, Editor, (SPIE, Bellingham, WA, 2003) pp. 453-463. 7. M. Adel, M. Ghinovker, J. Poplawski, E. Kassel, P. Izikson, I. Pollentier, P. Leray, D. Laidler, “Characterization of overlay mark ﬁdelity,” in Proceedings of SPIE Vol. 5038, Metrology, Inspection, and Process Control for Microlithography XVII, D. J. Herr, Editor, (SPIE, Bellingham, WA, 2003), pp. 437444.

This article is based on a paper that was originally presented at The International Conference on Characterization and Metrology for ULSI Technology 2005.

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