Fused Silica Etching

Fatty acids play important roles in biological systems and the newborns fatty acids requirements are covered only by the milk. It is of particular interest to qualify the content of the fatty acids in the milk. This study was performed to determine the levels of some fatty acids in the infant formulas and also to describe a method without derivatization for the fatty acids analysis and applying it to the control of infant formulas. Free fatty acids were produced by adding isopropanol- KOH to milk fat extract and heating it to saponify and acidify by H2SO4. Free fatty acids were extracted and were quantified by capillary gas chromatography on a fused silica column (AT-1000) and flame ionization detector. The average experimental values of lauric, palmitic, stearic and linoleic fatty acids contents of twenty infant formulas were 6.47, 16.52, 2.11 and 14.56 g/100g, respectively. The obtained experimental values of lauric and linoleic fatty acids contents of twenty infant formulas were ...

We have investigated the flash of light that accompanies laser damage using time-resolved spectroscopy. Damage events were initiated in the bulk of both fused silica and DKDP crystals with 355-nm 3-ns pulsed radiation. Spectra from the accompanying flash were recorded in the 200-500 nm wavelength range with 5-ns temporal resolution. Ten ns following damage initiation, the spectra were found to be roughly blackbody with temperatures on the order of 5000 K to 7000 K, depending on the material studied and excitation energy used. The observed temperatures and cooling rates can be related to the size and electron density of the plasma fireball that initiates the damage event.

In this note, we present our results from process development and characterization of reactive ion etching (RIE) of fused silica using a single-coated soft masking layer (KMPR® 1025, Microchem Corporation, Newton, MA). The effects of a number of fluorine-radical-based gaseous chemistries, the gas flow rate, RF power and chamber pressure on the etch rate and etching selectivity of fused silica were studied using factorial experimental designs. RF power and pressure were found to be the most important factors in determining the etch rate. The highest fused silica etch rate obtained was about 933 Å min−1 by using SF6-based gas chemistry, and the highest etching selectivity between the fused silica and KMPR® 1025 was up to 1.2 using a combination of CF4, CHF3 and Ar. Up to 30 µm deep microstructures have been successfully fabricated using the developed processes. The average area roughness (Ra) of the etched surface was measured and results showed it is comparable to the roughness obtained using a wet etching technique. Additionally, near-vertical sidewalls (with a taper angle up to 85°) have been obtained for the etched microstructures. The processes developed here can be applied to any application requiring fabrication of deep microstructures in fused silica with near-vertical sidewalls. To our knowledge, this is the first note on deep RIE of fused silica using a single-coated KMPR® 1025 masking layer and a non-ICP-based reactive ion etcher.

Conventional and scanning near-field optical microscopy techniques are cross referenced to femtosecond nonlinear-optical measurements and finite-element numerical simulations to visualize and analyze a strong confinement of electromagnetic radiation in guided modes of a photonic-crystal fiber with only a few air holes surrounding the fiber core. A nonlinear coefficient of about 120 W−1 km−1 is achieved at the wavelength of 670 nm for a fused-silica fiber with a full hexagonal cycle of closely packed air holes around the fiber core. The removal of a single element from this array of air holes is shown to frustrate field confinement in guided modes, leading to mode leakage.

In this work different ion-beam techniques demonstrate their capability for surface-roughness reduction down to the sub-nanometer scale. In ion beam direct smoothing, favorable characteristics in the development of surface topography are exploited and smoothing with the help of planarization layers is evaluated. Focusing on the common optical substrate materials quartz (fused silica) and silicon, it is shown that a surface-roughness reduction down to the ∼0.1 nm root mean square level can be achieved by optimization and combination of these techniques.